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  october 2006 rev 1 1/7 7 STTH60L04W ultrafast high voltage rectifier mian product characteristics features and benefits ultrafast switching low reverse current low thermal resistance reduces switching and conduction losses description the STTH60L04W uses st 400 v technology and is specially suited for use in switching power supplies, welding equipment, and industrial applications, as an output rectification diode. order codes i f(av) 60 a v rrm 400 v t j (max) 175 c v f (typ) 0.83 v t rr (max) 50 ns part number marking STTH60L04W stth60l04 k a do-247 STTH60L04W table 1. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 400 v i f(rms) rms forward current 90 a i f(av) average forward current t c = 90 c = 0.5 per diode 60 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 600 a t stg storage temperature range -55 to + 175 c t j maximum operating junction temperature 175 c www.st.com
characteristics STTH60L04W 2/7 1 characteristics to evaluate the conduction losses use the following equation: p = 0.8 x i f(av) + 0.0033 i f 2 (rms) table 2. thermal resistance symbol parameter value (max). unit r th(j-c) junction to case 0.70 c/w table 3. static electrical characteristics (per diode) symbol parameter test conditions min. typ max. unit i r (1) 1. pulse test: t p = 5 ms, < 2% reverse leakage current t j = 25 c v r = v rrm 50 a t j = 150 c 100 1000 v f (2) 2. pulse test: t p = 380 s, < 2% forward voltage drop t j = 25 c i f = 60 a 1.2 v t j = 150 c 0.83 1.0 table 4. dynamic characteristics (per diode) symbol parameter test conditions min typ max unit t rr reverse recovery time t j = 25 c i f = 1 a di f /dt = 50 a/s v r = 30 v 66 90 ns i f = 1 a di f /dt = 200 a/s v r = 30 v 36 50 i rm reverse recovery current t j = 125 c i f = 60 a v r = 200 v di f /dt = 100 a/s 15 a s factor softness factor t j = 125 c i f = 60 a v r = 200 v di f /dt = 100 a/s 0.4 t fr forward recovery time t j = 25 c i f = 60 a di f /dt = 200 a/s v fr = 1.1 x v fmax 600 ns v fp forward recovery voltage t j = 25 c i f = 60 a di f /dt = 200 a/s v fr = 1.1 x v fmax 3.2 v
STTH60L04W characteristics 3/7 figure 1. conduction losses versus average forward current (per diode) figure 2. forward voltage drop versus forward current (per diode) 0 10 20 30 40 50 60 70 80 0 1020304050607080 p(w)  =0.05  =0.1  =0.2  =0.5  =1 t i f(av) (a) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 i fm ( a ) t j =150c (maximum values) t j =150c (typical values) t j =25c (maximum values) v fm (v) figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. peak reverse recovery current versus di f /dt (typical values, per diode) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 z th(j-c) /r th(j-c) single pulse t p (s) 0 5 10 15 20 25 30 35 40 45 0 50 100 150 200 250 300 350 400 450 500 i rm (a) i f =i f(av) v r =200v t j =125c di f /dt(a/s) figure 5. reverse recovery time versus di f /dt (typical values, per diode) figure 6. reverse recovery charges versus di f /dt (typical values, per diode) 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 400 450 500 t(ns) i f =i f(av) v r =200v t j =125c di f /dt(a/s) rr 0 500 1000 1500 2000 2500 3000 0 100 200 300 400 500 q(nc) i f =i f(av) v r =200v t j =125c di f /dt(a/s) rr
characteristics STTH60L04W 4/7 figure 7. reverse recovery softness factor versus di f /dt (typical values, per diode) figure 8. relative variations of dynamic parameters versus junction temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 50 100 150 200 250 300 350 400 450 500 s factor i f < 2 x i f(av) v r =200v t j =125c di f /dt(a/s) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 25 50 75 100 125 i rm &t rr s factor i f =i f(av) v r =200v reference: t j =125c q rr t j (c) figure 9. transient peak forward voltage versus di f /dt (typical values, per diode) figure 10. forward recovery time versus di f /dt (typical values, per diode) figure 11. junction capacitance versus reverse voltage applied (typical values, per diode) 0 1 2 3 4 5 6 7 8 0 50 100 150 200 250 300 350 400 450 500 v fp (v) i f =i f(av) t j =125c di f /dt(a/s) 0 100 200 300 400 500 600 700 800 900 1000 0 50 100 150 200 250 300 350 400 450 500 t (ns) i f =i f(av) v fr =1.1 x v f max. t j =125c di f /dt(a/s) fr 100 1000 1 10 100 1000 c(pf) f=1mhz v osc =30mv rms t j =25c v r (v)
STTH60L04W package information 5/7 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 nm maximum torque value: 1.0 nm in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 5. do-247 dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 v h l5 l l3 v2 g f f3 l1 f2 l2 l4 v dia a d me
ordering information STTH60L04W 6/7 3 ordering information 4 revision history ordering type marking package weight base qty delivery mode STTH60L04W STTH60L04W do-247 4.4 g 30 tube date revision description of changes 26-oct-2006 1 first issue
STTH60L04W 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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